Tdv Microcut Kit (1Hack Saw+1Saw+1Sanding Blade)
Hack-saw frame designed to remove excesses from the interproximal area.
Designed to remove excesses of composites, adhesives, cement, and amalgams from the proximal area.
Also indicated for Inlay and Onlay, laminated veneers, and stripping in orthodontic procedures.
Features Device developed to adapt special components: Saw Blade:Remove surplus material without damage
140.45 AED
10 in stock
Description
Hack-saw frame designed to remove excesses from the interproximal area.
Designed to remove excesses of composites, adhesives, cement, and amalgams from the proximal area.
Also indicated for Inlay and Onlay, laminated veneers, and stripping in orthodontic procedures.
Features Device developed to adapt special components: Saw Blade:Remove surplus material without damage
Additional information
| Brand | TDV |
|---|---|
| Manufacture | TDV |
| Product Category | Dental |
| Product Sub-Category | Composite / Gic |
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